Make full use of thermal conductive silica gel sheet excellent performance, refuse to ironing machine

At present, the rapid development of science and technology progress, the market of high-tech advanced electronic products with each passing day, and is very popular with consumers friends, and the installation of electronic products in the use of any of the accessories are particularly important, including the selection of some thermal materials and other accessories, any electronic products in the process of operation will produce a lot of heat, to long product service life, Customer use experience performance is good, it is inevitable to design the process of internal heat dissipation and heat conduction of the product. At present, the widely used thermal conductive silica gel sheet is the heat dissipation and heat conduction material commonly used by many electronic manufacturers.

Thermal conductive silica gel sheet is specially used to fill the gap and thermal conductive powder to complete the connection between the heat source and the heat dissipation parts to transfer the heat, so as to achieve the effect of heat dissipation. The application of thermal conductive silica gel sheet will not only play the effect of heat dissipation, but also play the effect of insulation and shock absorption reinforcement between the parts. It is the only choice in the design and development of ultra-thin electronic products. Many people will doubt that the thermal conductivity of metal products is much higher than the thermal conductive silica gel sheet, why not directly use metal heat conduction and to use thermal conductive silica gel sheet? For example:

1.CPU and heat sink are the most common combination of heat dissipation in daily life. If metal is used, unless there is only one possible, heat sink and CPU are integrated, there will be gaps. It can be filled with any gap to achieve the best thermal conductivity, and the thermal conductive silica gel sheet has a natural micro viscosity, and it is very convenient to operate. Secondly, the thermal conductive silica gel sheet can effectively reduce the contact thermal resistance between the heat source interface and the heat dissipation device contact surface, and strengthen the performance of electronic devices. Therefore, in the process of research and development of the heat dissipation scheme of electronic products, the thermal conductive silica gel sheet is used as the heat conduction medium, which can make the contact surface between the heat source and the heat dissipation terminal or the shell more full, so that the performance can be the best.