Computer motherboard cooling application

Computer main board IC and heat sink or shell between the heat transfer medium program is the use of thermal conductive silica gel sheet, compared with the past relatively traditional thermal media materials such as thermal conductive silica gel, phase change and other materials, the quality of our production of thermal conductive silica gel sheet in the motherboard IC heat conduction application advantage, our production of thermal conductive silica gel sheet raw materials are imported from Japan, The thermal conductive silica gel sheet can better compress and make the contact area larger when used between the IC and the heat sink. So that the thermal conductivity effect to achieve good results. Therefore, the thermal conductive silica gel sheet has been widely used in the main IC. The thermal conductive silica gel sheet can be cut according to the size or shape of the IC, and has good insulation, convenient use, both sides are slightly sticky, you only need to tear the protective film on a smooth and clean surface