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2022-11-14 08:46:45
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In our daily life and work, the application range of thermal conductive silica gel sheet is very wide. It is widely used in electronic and electrical products control board, motor, high-end industrial and medical electronics, mobile and communication equipment, high-speed mass storage drive, computer host, laptop, hybrid car battery pack and other fields although the installation of the interface will be different, but the attention of the installation details are the same. In practical applications, is the thermal conductive silica gel sheet first attached to the chip or to the radiator?

The thermal conductive silica gel sheet can be pasted on the chip or the radiator first. Generally, it is pasted on the chip first. The specific place to paste depends on the assembly process of the product. After one side of the release film is torn off, the side that is torn off faces the radiator or chip. After pasting the thermal conductive silica gel sheet in line with the radiator, certain pressure should be applied, so that the thermal conductive silica gel sheet can be fixed, and the adhesion is more uniform, and the heat dissipation effect will be better.
The manufacturer recommends that you do not use heat-conducting silica gel sheets in combination. Superposition has great influence on thermal conductivity. Thermal conductive silica gel sheet is specially produced for the design of using the gap to transfer heat, which can fill the gap and complete the heat transfer between the heating part and the heat dissipation part. There is a certain gap between the thermal conductive silica gel sheet when stacked, and the thermal resistance will increase, thus affecting the thermal conductivity. It has been tested that the thermal resistance of the thermal conductive silicone sheet after superposition is about doubled, and the thermal conductive silicone sheet with glass fiber superposition is more than doubled, which seriously affects the performance of the thermal conductive silicone sheet.